PURPOSE: To make electrical connections between an LSI and a tape carrier and insulate ground electrodes by forming leads on both the LSI and tape carrier to the same height as the other side of the tape carrier where wiring patterns are formed.

CONSTITUTION: All copper foil leads 2, except ground leads, are formed to have a bend raised as high as the thickness of a tape carrier 3. Of the electrodes on the tape carrier, those for external connections are punched as a tape carrier type so that they have a bend of the same height as other electrodes on the other side of the tape carrier. According to this structure, there is no through hole for electrical connection, and the device cost is considerably reduced.