PURPOSE: To realize an automatic formation and transfer for the tape carrier type IC chip by constituting the IC automatic distributing device with the IC-attached frame supply part, draw-out transfer part, chip formation transfer part, XY table part and substrate part each.

CONSTITUTION: IC automatic distributing device A is constituted with IC-attached frame supply part D, draw-out transfer part E, chip formation transfer part F, XY table part G and substrate part H each. In such constitution, part D supports magazine carriage 2 to which magazine 1 is mounted via a pair of rails 3 in a free reciprocal way, and carriage 2 is shifted by air cylinder 4 to transfer magazine 1 to part E. Then frame hook 19 using the air cylinder provided at part H as the driving source is installed at part E to be then transferred to the next part F. After this, the formation is carried out using the punch and the dice to send the chip to part G via mobile block 41 which is driven by core cylinder 40. Then the positioning is given by positioning pin 42, and the chip is sent out onto the bonding substrate.