PURPOSE: To obtain the objective tape which exhibits excellent heat resistance, less incorporation of ionic impurities during the processing thereof and high insulating reliability by disposing a specific adhesive and a protective layer on an organic insulating film.
CONSTITUTION: An adhesive comprising an epoxy-modified polyamide comprising a reaction product from 30-55mol% polyamide having carboxylic acid terminals, preferably one obtained from a dimer acid as a starting material, still preferably one having a structure represented by the formula (wherein D is a dimer acid residue; and n is a natural number) in its molecular structure, 40-70mol% epoxy resin (e.g. Epikote 1001 produced by Yuka Shell Epoxy Co., Ltd.) and 1-15mol% polycarboxylic acid compound (e.g. trimesic acid), an epoxy resin and a curing agent for the resin (e.g. dicyandiamide), and then a protective layer (e.g. polyethylene terephthalate film) are disposed on an organic insulating film (e.g. polyimide film).
| JP2005500943 | Fuel tank |
| WO/2020/053599 | STRUCTURAL MATERIALS |
| JP2000177256 | TRANSFER SHEET FOR THERMAL TRANSFER RECORDING |
NOJIRI HITOSHI
HAYASHI TAKAYUKI
NAGANO KOSAKU
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