TAPING ELECTRONIC PART ASSEMBLY

Title:

TAPING ELECTRONIC PART ASSEMBLY

Document Type and Number:

Japanese Patent JP2950294

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a taping electronic part assembly, wherein electrostatic breakdown is easily prevented while the measurement of electrical characteristics is made possible.
SOLUTION: First and second leads 15 and 16 of a plurality of light-emitting diodes 11 are held with first and second tape-like members 12 and 13 to constitute an assembly. The first tape-like member 12 is provide with a resistance material layer 28. The resistance material layer 28 is connected to the first and second leads 15 and 16. A resistance value of the resistance material layer 28 between the first and second leads 15 and 16 contributes to an electric discharge of static electricity, and it is of about 105-107 Ω range for enabling check of the leak current of the light-emitting diode 11.

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Inventors:

SHIRAISHI AKIRA
SANO TAKESHI

Application Number:

JP20095297A

Publication Date:

September 20, 1999

Filing Date:

July 09, 1997

Export Citation:

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Assignee:

SANKEN DENKI KK

International Classes:

B65D85/86; B65D73/02; H01L21/60; H01L33/32; H01L33/56; H01L33/62; H05K13/02; (IPC1-7): H01L33/00; B65D73/02

Domestic Patent References:

JP6063962U
JP4312861Y1

Attorney, Agent or Firm:

Takano Noritsuji

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