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Title:
電気通信コネクタ
Document Type and Number:
Japanese Patent JP5411124
Kind Code:
B2
Abstract:
A telecommunications connector including a connector housing; a plurality of connector contacts in the connector housing; a substrate having first plated through holes for receiving termination ends of the connector contacts, the first plated through holes arranged in an area on the substrate; a plurality of termination contacts, the plurality of termination contacts positioned in second plated through holes in the substrate; the second plated through holes intersecting the area on the substrate.

Inventors:
Seamon John A
Medy ross david
Frey James
Yip Maxwell Kay
Celera Brian
Acuna chris
Purdy mark
Favor Joseph
Bellow Randy Jay
Vicchi anthony
Application Number:
JP2010501016A
Publication Date:
February 12, 2014
Filing Date:
March 28, 2008
Export Citation:
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Assignee:
The Seamon Company
International Classes:
H01R24/60; H01R13/6461; H01R13/658; H01R13/6592; H05K1/18
Domestic Patent References:
JP2004296250A
JP2001118642A
JP2006520070A
JP2007529098A
Foreign References:
US6371794
US6193526
Attorney, Agent or Firm:
Kenji Yoshida
Jun Ishida



 
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