Title:
TEMPERATURE SENSOR AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2021131284
Kind Code:
A
Abstract:
To provide a temperature sensor which enables the size of a joint area to be increased to thereby enable sufficiently high joint strength to be obtained, and a manufacturing method of the temperature sensor.SOLUTION: The temperature sensor comprises: an insulating substrate 2; a heat-sensitive element 3 provided on the surface of the insulating substrate; a pair of pieces of pattern wiring 4 which is patterned on the surface of the insulating substrate, and is connected at one end, to the heat-sensitive element ; a pair of recessed portions for jointing 5 which is formed in a recessed shape on both sides of the insulating substrate, and inside which a recessed-portion metal film is deposited; a pair of surface lands 6 which is formed with a metal film along the recessed portions for jointing on the surface of the insulating substrate and which is connected to the recessed-portion metal film, and to which the other end of the pair of pattern wirings is connected; and a pair of reverse-side land portions formed with metal films along the recessed portions for jointing on the reverse side of the insulating substrate and connected to the recessed-portion metal film.SELECTED DRAWING: Figure 1
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Inventors:
MATSUMOTO FUMIO
SATO HIROKI
TAKAHASHI KOHEI
SATO HIROKI
TAKAHASHI KOHEI
Application Number:
JP2020025954A
Publication Date:
September 09, 2021
Filing Date:
February 19, 2020
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
G01K7/22; H01C1/14
Domestic Patent References:
| JPH067204U | 1994-01-28 | |||
| JP2001127188A | 2001-05-11 |
Attorney, Agent or Firm:
Hideyuki Sugiura