PURPOSE: To prevent a plating electrode pattern from being exforiated from a cut end thereof and prevent any burr from being formed upon cutting thereof by forming the plating electrode pattern in an internal layer of a multilayered printed board material, and burying the plating electrode pattern in the internal layer such that the remaining part of the plating electrode pattern is exposed to a surface layer after a mounting board is separated and cut.

CONSTITUTION: For plating of a connection terminal 21, the outside of a two-dot chain line B is matched and power is supplied to a plating electrode pattern 3 to deposit a plated layer such as of gold by using each exposed terminal 21 as a plating electrode. Then, the plating electrode pattern 3 is cut down from a two-dot chain line A for each multilayered printed board material 1 to separate a mounting board 4, whereby the mounting board 4 having a plated connection terminal part 2 is yielded. Thereupon, the connection terminal part 2 allows the plated terminal 21 to be formed in the surface layer 11, and a remaining part 32 of the cut plating electrode pattern 3 is buried in the internal layer 12. Accordingly, the connection terminal 21 can be plated without exposing the remaining part 32 of the plating electrode pattern 3 to the surface layer 11.