PURPOSE: To enable small sizing of LSI package and high density installation and reduce the cost by inputting the signal from a magnet lead sensor to a gate of a test circuit and setting the mode of the test circuit to the test mode.

CONSTITUTION: By containing a magnet sensing element, for example, a magnet lead sensor 10 in an LSI package 1, and accessing a magnet material to the LSI package, the switch of magnet lead sensor 10 is turned on to input to the gate of a test circuit 12. And the voltage output from a contained hole magnet sensor is input as a signal to the test circuit and the mode of the test circuit is set in a test mode. Therefore, even if there is no unused bin (NC) in the LSI package, the test circuit can be driven. And by reducing the size of the LSI package, high density installation and cost reduction become possible.