Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMAL ANALYSIS DEVICE
Document Type and Number:
Japanese Patent JPH05296955
Kind Code:
A
Abstract:

PURPOSE: To reduce working time and obtain an amount of curvature with reproducibility by allowing a thermal analysis device to obtain the amount of bending which is performed manually as one of judgment of reliability of the device itself.

CONSTITUTION: Measurement data at two points indicating the range for obtaining the amount of bending are specified by a specifier which is constituted of a cursor specifier 3, a cursor operator's equipment 4, a specification point reader 5 out of measurement data which are stored in a data storage 1. A curvature width is retrieved automatically from the measurement data between two points which are specified by the specifier by a bending width retrieval equipment 6. The bending width retrieval equipment 6 calculates the amount of bending from the retrieved bending width.


Inventors:
SONE HIRONARI
Application Number:
JP9961692A
Publication Date:
November 12, 1993
Filing Date:
April 20, 1992
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SEIKO INSTR INC
International Classes:
G01N25/20; G06F17/40; (IPC1-7): G01N25/20; G06F15/74
Attorney, Agent or Firm:
Keinosuke Hayashi



 
Previous Patent: JPS5296954

Next Patent: SURFACE FLAW DETECTION DEVICE