THERMAL ENVIRONMENT MEASURING METHOD

Japanese Patent JP3284876

B2

PROBLEM TO BE SOLVED: To achieve an efficient evaluation of thermal comfortability by shortening measuring time and simplifying a measuring method in the measurement of thermal environment securing sufficient measuring accuracy concerning the thermal environment measuring method which enables objective evaluation of the thermal environment within a room.
SOLUTION: In this thermal environment measuring method, a plurality of thermosensitive sensors 2 are buried into a specified part of a dummy 1 to measure a thermal environment at a specified part of the dummy 1. This method has a non- heating time environment measuring process (S1) to measure a surface temperature and an internal temperature at each thermosensitive sensor 2 under a non-heating state, a heating time environment measuring process (S2) to measure the surface temperature and the internal temperature at each thermosensitive sensor 2 under a heating state, a sensor heat transfer computing process (S3) to compute a heat transfer rate at each thermosensitive sensor 2, a sensor working temperature computing process (S3) to compute a working temperature at each thermosensitive sensor 2, a specified part heat transfer rate computing process (S4) to compute a heat transfer rate at a specified part of the dummy 1 and a specified part working temperature computing process (S4) to compute a working temperature at a specified part of the dummy 1.

Noriyuki Miyake
county
Hiroaki Fujita

JP9719496A

May 20, 2002

April 18, 1996

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MITSUBISHI JIDOSHA KOGYO KABUSHIKI KAISHA

G01K17/00; F24F11/02; G01D21/00; G01W1/17; (IPC1-7): G01D21/00; F24F11/02; G01K17/00; G01W1/17

JP4131653A
JP587386A
JP6117882A
JP6147937A
JP727404A
JP6012569B2

Yu Sanada

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