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Title:
THERMAL HEAD AND THERMAL PRINTER
Document Type and Number:
Japanese Patent JP2015101026
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To supply a thermal head capable of downsizing.SOLUTION: A thermal head X1 includes: a substrate 7; a plurality of heat generation parts 9 provided on the substrate 7 and arrayed in a main scan direction X; a plurality of IC terminals 6 provided on the substrate 7 and electrically connected to a drive IC 11 for controlling the drive of the heat generation parts 9; a plurality of external terminals 4 provided on the substrate 7; a plurality of individual electrodes 19 provided on the substrate 7 and electrically connecting the heat generation parts 9 and the IC terminals 6 individually; a plurality of connection electrodes 21 provided on the substrate 7 and electrically connecting the IC terminals 6 and the external terminals 4; and a ground electrode 2 provided on the substrate 7 and extending in the main scan direction X. The ground electrode 2 is arranged so as to be surrounded by the IC terminals 6, the connection electrodes 21 and the external terminals 4, and in the main scan direction X, distance Wbetween IC terminals located on both ends is longer than length Wof the ground electrode 2.

Inventors:
KAWABATA NOBUYUKI
TERADA KENJI
TODA YUKINOBU
Application Number:
JP2013244013A
Publication Date:
June 04, 2015
Filing Date:
November 26, 2013
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
B41J2/345
Domestic Patent References:
JPH0295642U1990-07-30
JPS6137942U1986-03-10
JP2009234260A2009-10-15
JPH0939284A1997-02-10
JPH0647943A1994-02-22
JPS6076355A1985-04-30
JP2005231169A2005-09-02
JP2012228871A2012-11-22