To improve workability for connecting a long ceramic substrate with a long resin substrate and to improve productivity of a thermal head by a method wherein the long ceramic substrate and long resin substrate are bonded with each other such that edge faces thereof along the long sides are abutted with each other and a circuit conductor and a wiring conductor are electrically connected with each other by a solder welding so as to bridge the abutment portion in an arc-shaped cross section.

A long ceramic substrate 1 having a plurality of heating resistors and a circuit conductor 3 provided on the top face and a long resin substrate 5 having a wiring conductor 6 to be electrically connected to the circuit conductor 3 are bonded with each other in a condition that both edge faces of both of the substrates 1, 5 along the long sides thereof are abutted with each other. The circuit conductor 3 and wiring conductor 4 are connected to each other by a solder 10 welding so as to bridge the abutment portion in an arc-shaped cross section. Both of the top faces of the ceramic substrate 1 and resin substrate 5 are set in roughly the same height.