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Patent Searching and Data


Title:
THERMAL HEAD
Document Type and Number:
Japanese Patent JPS61237659
Kind Code:
A
Abstract:

PURPOSE: To suppress the upheaval and thermal deformation cycles of the center of glass projection and the breakage of exothermic elements by repeating heating pulses by providing a glass projection of a thermal expansion coefficient with the range of 30W35×10-7/°C for the lower part of heating elements on an insulating base plate.

CONSTITUTION: A heating element 3 is formed on the top of a trapezoidal projection 2 formed on an insulating alumina base plate 1. Conductors 4 are formed on the plate 1 and the projection 2 connectedly to both ends of the heating element 3 and led to the end portion through the upside of the base plate 1. The projection 2 is made of glass powder of a thermal expansion coefficient of 30W35×10-7/°C, having constituents, e.g., SiO2, Al2O3, B2O3 and Na2O, and a grain size distribution of 0.3W30μm with max. distribution of 6W10μm. The glass powder is melted at 950°C for 8min to form the projection 2. Since the thermal expansion coefficient of the projection 2 below the heating element 3 is small, thermal deformation of the glass projection 2 can be lessened even when the temperature of the heating element is raised by application of pulse voltage.


Inventors:
OGATA KAZUO
Application Number:
JP7963085A
Publication Date:
October 22, 1986
Filing Date:
April 15, 1985
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B41J2/335; H05K1/02; H05K1/16; (IPC1-7): B41J3/20; H05K1/16
Attorney, Agent or Firm:
Toshio Nakao