Title:
THERMALLY CONDUCTIVE FOAM SHEET
Document Type and Number:
Japanese Patent JP2018127617
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a material having excellent thermal conductivity, and having a reduced weight for a reduced load to an electronic apparatus.SOLUTION: A thermally conductive foam sheet contains a main agent composed of resin or composed of the resin and a plasticizer of 100 pts.mass, and a carbon fiber 40-300 pts.mass.SELECTED DRAWING: None
Inventors:
MATSUI RIE
Application Number:
JP2018019343A
Publication Date:
August 16, 2018
Filing Date:
February 06, 2018
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08J9/04; B32B5/18; B32B27/00; B32B27/18; B32B27/22; C08K3/00; C08K7/02; C08L23/16; C08L91/00; H01L23/36
Attorney, Agent or Firm:
Masahiro Taguchi
Shigeru Torayama
Shigeru Torayama