Title:
THERMALLY CONDUCTIVE RESIN MATERIAL
Document Type and Number:
Japanese Patent JP2005054094
Kind Code:
A
Abstract:
To provide a thermally conductive resin material in which a thermally conductive property having a level of ≥0.4W/m×K thermal conductivity can be imparted by using a small amount of filler.
The thermally conductive resin material is obtained by dispersing carbon into a mixture of two or more kinds of resins. According to the present invention, sufficient thermally conductive property is imparted to the resin material even when a small amount of filler (carbon) is compounded therein.
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Inventors:
INAMURA TOMOMI
OBA TAKESHI
OBA TAKESHI
Application Number:
JP2003287577A
Publication Date:
March 03, 2005
Filing Date:
August 06, 2003
Export Citation:
Assignee:
BRIDGESTONE CORP
International Classes:
C08L101/00; C08K7/06; (IPC1-7): C08L101/00; C08K7/06
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Saori Shigematsu
Katsunari Kobayashi
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