THERMALLY CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR DEVICE

Japanese Patent JP2023104800

A

To provide a thermally conductive silicone composition having good compressibility even when filled with a large amount of thermally conductive filler.SOLUTION: There is provided a thermally conductive silicone composition which comprises (A) an organopolysiloxane having no alkoxysilyl group which has a kinematic viscosity at 25°C of 10 to 100000 mm2/s and, (B) an organopolysiloxane having an alkoxysilyl group, (C) one or more thermally conductive fillers having a thermal conductivity of 10 W/m K or more selected from irregular, round, and polyhedral shapes and (D) hydrophobic spherical silica particles having a D50 in the particle size distribution on a volume basis of 0.005 to 1 μm, a D90/D10 of 3 or less and an average circularity of 0.8 to 1, wherein the amount of the component (C) is 40 to 85% by volume of the total thermally conductive silicone composition.SELECTED DRAWING: None

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TOYA WATARU
IWATA MITSUHIRO
YAMADA KUNIHIRO
MATSUMURA KAZUYUKI

JP2022006002A

July 28, 2023

January 18, 2022

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SHINETSU CHEMICAL CO

C08L83/04; C08K3/22; C08K3/28; C08K3/36; C08K9/06; C08L83/06; H01L23/373

Mikio Yoshimiya
Toshihiro Kobayashi
Toru Otsuka

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