Title:
THERMALLY CONDUCTIVE SILICONE COMPOSITION
Document Type and Number:
Japanese Patent JP2023062399
Kind Code:
A
Abstract:
To provide a thermally conductive silicone composition which provides both high thermal conductivity and shift resistance.SOLUTION: There is provided a thermally conductive silicone composition which comprises (C) one or more aluminum nitride particles selected from irregular, rounded and polyhedral shapes having an average particle diameter of 4 μm or more and less than 50 μm, (D) one or more aluminum nitride particles selected from irregular, rounded and polyhedral shapes having an average particle diameter of 50 μm or more and 150 μm or less, and (E) inorganic particles having an average particle diameter of 0.1 μm or more and less than 4.0 μm, wherein the total amount of the component (C) and the component (D) is 20 mass% or more and less 80 mass% of the whole of the composition, the blending amount of the component (E) is 20 mass% or more and less than 50 mass% of the whole of the composition and the ratio of the component (D) to the total amount of the component (C) and the component (D) is 5 mass% or more and less than 50 mass%.SELECTED DRAWING: None
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Inventors:
TOYA WATARU
Application Number:
JP2021172352A
Publication Date:
May 08, 2023
Filing Date:
October 21, 2021
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08L83/04; C08K3/22; C08K3/28; C08K7/00; C08L83/05; C08L83/06; C08L83/07; H01L23/373
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toru Otsuka
Toshihiro Kobayashi
Toru Otsuka