Title:
THERMOELECTRIC MODULE
Document Type and Number:
Japanese Patent JP3583112
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve long term reliability by preventing a thermoelectric module from being broken down.
SOLUTION: The thermoelectric module comprises a supporting board 1, a plurality of thermoelectric elements 2 arranged on the board 1, wiring conductors 4 for electrically coupling between the plurality of the elements 2, and an external connection terminal provided on the board 1 to electrically connect to the conductors 4. The elements 2 and the conductors 4 are connected via a solder layer 5. The ratio of a mean length of one side in a section of the element 2 to a sum of the thickness of the layer 5 and the thickness of the conductor 4 is 5 to 15.
Inventors:
Masato Fukudome
Koichi Tanaka
Kenichi Tajima
Koichi Tanaka
Kenichi Tajima
Application Number:
JP2002087269A
Publication Date:
October 27, 2004
Filing Date:
March 27, 2002
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L35/32; H01L35/08; H01L35/16; (IPC1-7): H01L35/32; H01L35/08; H01L35/16
Domestic Patent References:
| JP2003092434A |
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