THERMOPLASTIC RESIN COMPOSITION FOR INTEGRAL MOLDING WITH SILICONE RUBBER AND INTEGRALLY MOLDED ITEM THEREOF WITH SILICONE RUBBER

Title:

THERMOPLASTIC RESIN COMPOSITION FOR INTEGRAL MOLDING WITH SILICONE RUBBER AND INTEGRALLY MOLDED ITEM THEREOF WITH SILICONE RUBBER

Document Type and Number:

Japanese Patent JP3127814

Kind Code:

B2

Abstract:

PURPOSE: To obtain a thermoplastic resin compsn. for integral molding which has characteristics inherent in a thermoplastic resin, adheres to a silicone rubber very strongly, and is suitable for integral molding with a silicone rubber and to obtain an integrally molded item thereof with a silicone rubber.
CONSTITUTION: 100 pts.wt. thermoplastic resin is compounded with 2-12 pts.wt. thermoplastic resin oligomer contg. 0.1-35wt.% aliph. unsatd. groups. An integrally molded item is formed from the resulting compsn. and a silicone rubber.

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Inventors:

Hironao Fujiki
Shigeki Shuto

Application Number:

JP34986095A

Publication Date:

January 29, 2001

Filing Date:

December 21, 1995

Export Citation:

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Assignee:

Shin-Etsu Chemical Co., Ltd.

International Classes:

B29C45/16; B32B25/08; B32B25/20; C08L23/10; C08L69/00; C08L83/04; C08L101/00; (IPC1-7): C08L101/00; B29C45/16; B32B25/08; B32B25/20; C08L69/00; C08L83/04

Domestic Patent References:

JP63183843A

Attorney, Agent or Firm:

Takashi Kojima

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