Title:
THERMOPLASTIC RESIN COMPOSITION AND MOISTUREPROOF PAPER USING THE SAME
Document Type and Number:
Japanese Patent JP3867021
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a moistureproof paper low in tackiness, excellent in moistureproofness, and excellent in disintegrability in recycling and to provide a thermoplastic resin composition to be used in such a moistureproof paper.
SOLUTION: The thermoplastic resin composition contains (a) a polyethylene having a number-average molecular weight (Mn) in the range of 2,000-10,000 as measured by gel permeation chromatography, a melting point in the range of 65-100°C as measured with a differential scanning calorimeter (DSC), and a density in the range of 880-910 kg/m3 as measured by a density gradient tube method and satisfying the relationship: 0.501xD-366≥ Tc [wherein Tc (°C) is the crystallization temperature as measured with a DSC at a temperature lowering rate of 2°C/min, and D (kg/m3) is the density], (b) a tackifying resin, and (c) a wax.
Inventors:
Hideo Toyoda
Application Number:
JP2002181619A
Publication Date:
January 10, 2007
Filing Date:
June 21, 2002
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
B05D5/00; C08L23/04; B05D7/00; C08L91/06; D21H19/18; D21H19/22; D21H21/16; (IPC1-7): C08L23/04; C08L91/06; D21H19/18; D21H19/22; D21H21/16; //B05D5/00; B05D7/00
Domestic Patent References:
JP10003264A | ||||
JP2001192512A | ||||
JP2002003660A | ||||
JP2000684A |
Foreign References:
WO2002033710A1 |
Attorney, Agent or Firm:
Shunichiro Suzuki
Koji Makimura
Koji Makimura
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