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Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ITEM
Document Type and Number:
Japanese Patent JP3613990
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a thermoplastic resin compsn. for plastic molding which mainly comprises a thermoplastic resin typified by a polyolefin resin or a polyester resin and which has an almost equal transparency to that of a blank though the compsn. exhibits ultraviolet-absorbing effects and to provide a molded item obtd. therefrom.
SOLUTION: This compsn. is prepd. by compounding a thermopiastic resin with an inorg. compd. having ultraviolet-absorbing effects and a pigment dispersant. Based on 100 pts.wt. thermoplastic resin, the amt. of the inorg. compd. added is 0.01-3.00 pts.wt., and the ratio (R) of the amt. of the pigment dispersant added to that of the inorg. compd. added satisfies the relation: 0.1≤R≤5. The compsn. gives a transparent molded item.


Inventors:
Masayoshi Suzuda
Keiko Nakamura
Mamoru Sano
Application Number:
JP23403798A
Publication Date:
January 26, 2005
Filing Date:
August 20, 1998
Export Citation:
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Assignee:
Toppan Printing Co., Ltd.
International Classes:
B65D1/00; B65D1/09; C08J5/18; C08K3/22; C08K5/09; C08K5/10; C08K5/20; C08K13/02; C08L101/00; (IPC1-7): C08L101/00; C08K3/22; C08K5/09; C08K5/10; C08K5/20
Domestic Patent References:
JP5025371A
JP55050055A
JP2000063647A
JP2000062007A