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Title:
非芳香族尿素を反応促進剤として含む熱硬化性エポキシ樹脂組成物
Document Type and Number:
Japanese Patent JP5444241
Kind Code:
B2
Abstract:
Heat-hardening epoxide resin composition (Q) comprises: (a) at least an epoxide resin with an average of more than one epoxide group per molecule; (b) at least one hardener for epoxy resins, where the hardener: is activated at high temperature, and is an amine, amide, carboxylic acid anhydride or polyphenol; (c) at least one amide group containing catalyst (I); and (d) tenacity improver. Heat-hardening epoxide resin composition (Q) comprises: (a) at least an epoxide resin with an average of more than one epoxide group per molecule; (b) at least one hardener for epoxy resins, where the hardener: is activated at high temperature, and is an amine, amide, carboxylic acid anhydride or polyphenol; (c) at least one amide group containing catalyst (I) of formula ((R 1>-NH-C(=O)-N(R 2>)(R 3>)) n) (Ia) or ((R1a-N(R2a)-C(=O)-N(R3a)) m) (Ib); and (d) tenacity improver. R 1>H or a n-valent aliphatic, cycloaliphatic or araliphatic residue; either R 2>, R 3>alkyl or aralkyl; or R 2>R 3>a bivalent 3-20C-aliphatic residue, whose one part is optionally substituted by 5-8, preferably 6 membered heterocyclic ring; R1a : m-valent aliphatic, cycloaliphatic or araliphatic residue; R2a : alkyl, aralkyl or alkylene group; R3a : H, alkyl or aralkyl; and n, m : 1-4, preferably 1 or 2. Independent claims are included for: (1) a process for adhering heat stable materials, preferably metals, comprising contacting the materials with (Q) and hardening at 100-220, preferably 120-200[deg] C; (2) an adhered article, obtained by the above process; and (3) foamed articles, which is obtained by partially filling the cavities with (Q) and heating the adhered material at 100-220, preferably 120-200[deg] C.

Inventors:
Andreas Crammer
Jürgen Finter
Karlsten Flick
Urs Reinegger
Jan Olaf Schulenburg
Application Number:
JP2010533591A
Publication Date:
March 19, 2014
Filing Date:
November 14, 2008
Export Citation:
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Assignee:
Seeker Technology AG
International Classes:
C08G59/40; C09J5/06; C09J11/06; C09J163/00
Domestic Patent References:
JP2008545039A
JP2007504341A
JP2006509879A
JP2001348418A
Foreign References:
WO2007004184A1
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro



 
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