To provide a thermosetting resin composition for adhesive films excellent in heat resistance to soldering, adhesion to copper and storage stability and film processability.
The thermosetting resin composition comprises (A) a resin obtained by melt-kneading an epoxy group-containing ethylene-based copolymer obtained by polymerizing (a1) ethylene with (a2) a monomer represented by general formula (1) (wherein R is a 2-18C hydrocarbon group having an aliphatic carbon-carbon double bond, wherein the hydrocarbon group may be substituted with a halogen atom, a hydroxy group or a carboxy group; X is a single bond or carbonyl group) and (B) a copolymer obtained by polymerizing (b1) ethylene with (b2) an α,β-unsaturated carboxylic anhydride and having 1-50% ring-opening ratio of acid anhydride group in the copolymer.
HASEGAWA TOSHIYUKI
FUJIKI TORU
IYAMA HIRONOBU
