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Title:
THERMOSETTING RESIN COMPOSITION CONTAINING MAGNETIC SUBSTANCE, ADHESIVE SHEET USING THE SAME AND COPPER FOIL WITH ADHESIVE
Document Type and Number:
Japanese Patent JP2006001998
Kind Code:
A
Abstract:

To obtain a thermosetting resin composition containing a magnetic substance, which has excellent heat resistance and adhesiveness, absorbs electromagnetic waves radiated from the inside of a circuit and is previously processed into a sheet form, an adhesive sheet obtained by making the thermosetting resin composition containing a magnetic substance into a sheet form and a copper foil with an adhesive.

The thermosetting resin composition containing a magnetic substance is obtained by polymerizing a bifunctional epoxy resin with a bifunctional phenol in the equivalent ratio of epoxy group/phenolic hydroxy group of 1/(0.9-1.1) to give a straight chain epoxy polymer and mixing the polymer with a soft magnetic substance.


Inventors:
TANABE TAKAHIRO
KUMAKURA YOSHITOSHI
Application Number:
JP2004178189A
Publication Date:
January 05, 2006
Filing Date:
June 16, 2004
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L63/00; B32B15/08; B32B15/092; C08K3/08; C09J7/00; C09J11/04; C09J163/00
Domestic Patent References:
JP2002201447A2002-07-19
JP2003096423A2003-04-03
JPH11147933A1999-06-02
JPH11147934A1999-06-02
JP2002265912A2002-09-18