Title:
THERMOSETTING RESIN COMPOSITION FOR ENCAPSULATION OF PHOTOSEMICONDUCTOR ELEMENT AND PHOTOSEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME
Document Type and Number:
Japanese Patent JP2009144066
Kind Code:
A
Abstract:
To provide a thermosetting resin composition for the encapsulation of photosemiconductor elements, usable in the form of a liquid, capable of suppressing the generation of cracks in the case of resin encapsulation and having excellent heat-resistance and light resistance.
The thermosetting resin composition for encapsulating photosemiconductors contains the component (C) in addition to the components (A) and (B). (A) A modified triglycidyl isocyanurate containing an organic group esterified with an acid anhydride as at least one of three glycidyl groups of triglycidyl isocyanurate; (B) an acid anhydride; and (C) a polyorganosiloxane.
Inventors:
NORO KOJI
SHIMIZU YUSUKE
SHIMIZU YUSUKE
Application Number:
JP2007323233A
Publication Date:
July 02, 2009
Filing Date:
December 14, 2007
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C08G59/20; C08G59/42; C08L63/00; C08L83/04; H01L23/29; H01L23/31; H01L33/48; H01L33/56
Domestic Patent References:
| JP2006274249A | 2006-10-12 |
Foreign References:
| WO2006035641A1 | 2006-04-06 |
Attorney, Agent or Firm:
Masahiko Nishito
Iisaki Aika
Yuko Saito
Iisaki Aika
Yuko Saito