Title:
配線板用熱硬化性樹脂組成物とその成形体および多層プリント配線板
Document Type and Number:
Japanese Patent JP5116921
Kind Code:
B2
Inventors:
Yamada Tatsuichi
Application Number:
JP2001027497A
Publication Date:
January 09, 2013
Filing Date:
February 02, 2001
Export Citation:
Assignee:
Taiyo Holdings Co., Ltd.
International Classes:
C08J5/18; H05K3/46; C08G59/44; C08K3/26; C08K5/16; C08L15/00; C08L63/02
Domestic Patent References:
| JP63057631A | ||||
| JP5078454A | ||||
| JP9003306A | ||||
| JP55115442A | ||||
| JP11152340A | ||||
| JP11140281A | ||||
| JP2000188451A | ||||
| JP2000007974A |
Attorney, Agent or Firm:
Amagi International Patent Office