Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH01146922
Kind Code:
A
Abstract:
PURPOSE:To obtain the title composition which gives a molded article having excellent heat aging resistance and weatherability, by mixing a specified pre- reaction product, a vinyl compound containing epoxy groups, a triallyl compound, a curing agent for epoxy, and a radical-polymerization initiator. CONSTITUTION:A polyamino compound (a) and 0.1-10 gram equivalent, per gram equivalent of component (a), of an unsaturated bismaleimide compound (b) are heated and kneaded together at 70-170 deg.C for 2-15min to give a pre- reaction product (A) having a softening point of 60-110 deg.C. 100 pts.wt. component A is mixed with 1-100 pts.wt. component (B) comprising a vinyl compound containing epoxy groups and, if required, an aliphatic epoxy compound which has a viscosity of 1-30,000cps and an epoxy equivalent of 20-1,000 and does not contain a vinyl group; 2-100 pts.wt. triallyl compound (C) capable of dissolving component A; 0.01-100 pts.wt., based on 100 pts.wt. components A and B in total, curing agent (D) for epoxy resin; and 0.01-10 pts.wt., based on 100 pts.wt. components A-C in total, radical-polymerization initiator (E).
Inventors:
KAMEYAMA MASAO
KUMAKAWA SHIGEYUKI
KUMAKAWA SHIGEYUKI
Application Number:
JP30568487A
Publication Date:
June 08, 1989
Filing Date:
December 04, 1987
Export Citation:
Assignee:
MITSUI PETROCHEMICAL IND
International Classes:
C08L63/00; C08G59/32; C08G59/40; (IPC1-7): C08G59/32; C08G59/32; C08L63/00
Attorney, Agent or Firm:
Ikuo Suzuki (1 person outside)