Title:
THICK FILM CONDUCTOR PASTE COMPOSITION AND PRODUCTION OF MULTI-LAYER INTERCONNECTION BOARD
Document Type and Number:
Japanese Patent JP3160951
Kind Code:
B2
Abstract:
PURPOSE: To obtain a multi-layer interconnection board not causing space between a conductor and an insulating material, having excellent reliability.
CONSTITUTION: A multi-layer interconnection board is obtained from a process for forming a wiring pattern from a conductive paste composition on a base film by using a thick film conductor paste composition comprising an inorganic component containing copper oxide powder and one or more of Pd, Pt, CrSi2, ZrSi2 and TaSi2 and an organic vehicle and then making an insulating layer from an insulating material paste consisting essentially of glass ceramics or crystallized glass to prepare a transfer sheet, a process for boring the transfer sheet at a desired position, transferring the conductor and the insulating material on the base film to the ceramic substrate by thermal contact bonding and successively laminating the conductor and the heat insulating material to the substrate, a process for removing the organic binder by heat treatment in air, a process for reducing the conductor by heat treatment in hydrogen, and a process for sintering the heat insulating material and the conductor by heat treatment in nitrogen.
Inventors:
Minehiro Itagaki
Ryo Kimura
Kazuyuki Okano
Mariko Ishikawa
Seigo Shiraishi
Ryo Kimura
Kazuyuki Okano
Mariko Ishikawa
Seigo Shiraishi
Application Number:
JP21202891A
Publication Date:
April 25, 2001
Filing Date:
August 23, 1991
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
C09D5/24; H01B1/16; H01B1/22; H05K1/09; H05K3/46; (IPC1-7): C09D5/24; H01B1/16; H05K3/46
Domestic Patent References:
| JP61289691A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)