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Title:
THICK FILM MODULE HEAD FOR THERMOSENSITIVE RECORDING
Document Type and Number:
Japanese Patent JPS5352136
Kind Code:
A
Abstract:

PURPOSE: To perform heat-recording of satisfactory density ratios without increasing electric power by preheating a thick film module head with a resistor.


Inventors:
NAKATANI MITSUO
KUROKI TAKASHI
SHIYOUJI TOSHIAKI
Application Number:
JP12614276A
Publication Date:
May 12, 1978
Filing Date:
October 22, 1976
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H01C7/00; B41J2/38; B41M5/26; (IPC1-7): B41M5/26; H01C7/00
Domestic Patent References:
JPS516736A1976-01-20



 
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