PURPOSE: To avoid the cracking of an insulating layer by a method wherein the insulating layer contains a crystallized glass and a low melting point glass while a wiring layer is baked at the temerature higher than the softening point of the low melting point glass lower than the crystallizing temperature.
CONSTITUTION: A crystallizing glass and a low melting point glass is mixed with each other to manufacture an insulating material and then this insulating material is kneaded with a vehicle so as to produce an insulating paste. Besides, a silicon paste is produced. Next, a substrate is printed with insulating patterns 1, 2 using the insulating paste. Next, coil pattern 3 is printed with the silver paste likewise successively, a coil pattern 5, an insulating pattern 6 are printed to form a wiring layer. Next, a baked wiring layer forming step by baking the substrate at 700°C is repeated to laminate baked wiring layers for tack fixing step. Furthermore, wiring layers are laminated and baked on this tack fixed wiring layer to manufacture the title thick film multilayer substrate.
KIMURA RYO
HASHIMOTO AKIRA
KODAIRA KEIGO
