Title:
THICK FILM WIRING BOARD FOR HIGH WITHSTAND VOLTAGE
Document Type and Number:
Japanese Patent JPH0289393
Kind Code:
A
Abstract:
PURPOSE: To prevent generation of discharge between conductors and to make it excellent in withstand voltage characteristics and to enable high density mounting by interposing a dielectric between adjacent conductors in close contact.
CONSTITUTION: Silver-palladium paste is printed on the upper face of a ceramic board 1 and then is baked so as to make a conductor 2, and next crystalline glass paste is printed between conductors 2 such that the end may contact with some parts of the conductors, and then those are baked, whereby a thick film wiring board for high withstand voltage where a dielectric 3 is formed is obtained.
Inventors:
YAMANAKA HISAYOSHI
ISHIKAWA EIICHI
KUROSAWA MASAKAZU
ISHIKAWA EIICHI
KUROSAWA MASAKAZU
Application Number:
JP24186288A
Publication Date:
March 29, 1990
Filing Date:
September 27, 1988
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H05K3/28; (IPC1-7): H05K3/28
Attorney, Agent or Firm:
Kunihiko Wakabayashi
Next Patent: JPH0289394