Title:
厚み測定装置および厚み測定方法
Document Type and Number:
Japanese Patent JP7109584
Kind Code:
B2
Abstract:
Provided are a thickness measurement device and a thickness measurement method, whereby the thickness of a layered measurement object can be detected accurately without contact even when the thickness is small. A thickness measurement device (100) is provided with a retaining conveyance mechanism part (1) and a thickness measurement mechanism part (2). The retaining conveyance mechanism part (1) includes a retaining member (11) comprising a rigid material in contact with a measurement object (9), an elastic member (12) in contact with the retaining member (11), and a joint member (10) comprising a rigid material in contact with the reverse side of the elastic member (12) from the retaining member (11). The thickness measurement mechanism part (2) includes a base member (20) comprising a rigid material which faces the retaining member (11) and is capable of clamping the measurement object (9) between the base member (20) and the retaining member (11).
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Inventors:
Baba Toshimichi
Yukihiro Toku
Yusaku Yamai
Yukihiro Toku
Yusaku Yamai
Application Number:
JP2020558186A
Publication Date:
July 29, 2022
Filing Date:
October 24, 2019
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
G01B11/06; B65H5/08
Domestic Patent References:
| JP2001264044A | ||||
| JP2004055995A | ||||
| JP53087258A | ||||
| JP2003294419A |
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office
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