Title:
THICKNESS MEASURING DEVICE
Document Type and Number:
Japanese Patent JP2022043625
Kind Code:
A
Abstract:
To provide a thickness measuring device that can accurately measure the thickness of a test piece without need for powder or the like for reducing the sticking of a measuring indenter.SOLUTION: A thickness measuring device includes: a lower part measuring indenter 30 (measuring indenter) operated so as to be in contact with and away from a test piece 50; a digital gauge (measuring instrument) that is disposed on an opposite side to the lower part measuring indenter 30 of the test piece 50, measures the thickness of the test piece 50 while sandwiching the test piece 50 between the lower part measuring indenter 30 and itself; an anti-sticking jig 40 attached to the lower part measuring indenter 30 and provided so as to be capable of projection movement toward the test piece 50; and a spring member 42 (urging member) that urges the anti-sticking jig 40 so as to project it from the lower part measuring indenter 30.SELECTED DRAWING: Figure 3
Inventors:
SAITO SHUNSUKE
Application Number:
JP2020148997A
Publication Date:
March 16, 2022
Filing Date:
September 04, 2020
Export Citation:
Assignee:
SHIMADZU CORP
International Classes:
G01B5/06
Domestic Patent References:
| JP2002228436A | 2002-08-14 | |||
| JPH11271199A | 1999-10-05 | |||
| JPH0238838A | 1990-02-08 |
Attorney, Agent or Firm:
Patent Business Corporation Kushibuchi International Patent Office