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Patent Searching and Data


Title:
THIN FILM FORMING DEVICE AND FORMATION OF COMPOUND THIN FILM USING THE DEVICE
Document Type and Number:
Japanese Patent JPH11172430
Kind Code:
A
Abstract:

To form a dense thin film at a high deposition rate.

In a reactive sputtering system provided with a substrate holding means 7 for holding a substrate 2, a target holding means 12 for holding a target 1, a gas feeding means 3 for feeding a sputtering gas for sputtering the target to the inside of a reaction chamber and an electric power feeding means 8 for feeding electric power for discharging between the target and the substrate, a partition member 6 having plural opening holes 6a is provided between the target and the substrate, and means 11 and 50 for feeding a reactive gas and microwaves to the space is provided between the partition member and the substrate.


Inventors:
SONE KAZUHO
SUZUKI NOBUMASA
Application Number:
JP28097298A
Publication Date:
June 29, 1999
Filing Date:
October 02, 1998
Export Citation:
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Assignee:
CANON KK
International Classes:
C23C14/34; H01L21/203; H01L21/31; (IPC1-7): C23C14/34; H01L21/203; H01L21/31
Attorney, Agent or Firm:
Marushima Giichi