PURPOSE: To suppress the sticking of deposited materials to undesired points by using a mask member which has an aperture to regulate a deposition region and has the high sticking force to the deposited materials at the time of depositing a 2nd thin film by a deposition method from gaseous phase.

CONSTITUTION: The component particles of a target 88 are driven out by a sputtering gas, such as Ar, and are deposited on a substrate B through the aperture 92 of the mask 93 at the time of sputtering, by which a protective film is formed on the magnetic thin film on the substrate B. The flying particles stick onto the mask 93 at the time of the sputtering but the sticking force of the flying particles is increased by heating the mask 93 to prevent the stuck particles from falling. At least the target side of the surface of the mask 93 is subjected to a surface treatment to increase the sticking force of the particles. The sticking of the flying particles to the undesired points is prevented by providing the mask 93 having the high sticking force to the particles. The falling of the particles sticking to the mask 93 onto the target 88 by peeling and the consequent generation of discharge abnormality are prevented.