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Patent Searching and Data


Title:
TI-NI-CU ALLOY THIN WIRE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH0382727
Kind Code:
A
Abstract:

PURPOSE: To manufacture the alloy thin wire in which TixNiy precipitated products are suppressed and to obtain the Ti-Ni-Cu alloy thin wire of a circular section having ≥10at% Cu content at a low cost by substituting specified ratio or above of Ni in a Ti alloy contg. specified ratio of Ni by Cu.

CONSTITUTION: The Ti-Ni series shape memory alloy thin wire including Cu has the compsn. in which ≥10at% of Ni in an alloy constituted of 49 to 51at% Ni and the balance Ti is substituted by Cu. For manufacturing the thin wire, a coolant layer 9 is formed in a cylindrical drum 1 which is rotating by a centrifugal force, and the molten metal of the Ti-Ni-Cu alloy having the above compsn. is injected from an injection device 14 as a jet to solidity the above molten metal.


Inventors:
ISHIKAWA HIROSHI
KIMURA SAKAE
Application Number:
JP21590389A
Publication Date:
April 08, 1991
Filing Date:
August 24, 1989
Export Citation:
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Assignee:
TOKIN CORP
International Classes:
B22D11/06; C22C1/00; C22C1/02; C22C19/03; (IPC1-7): B22D11/06; C22C1/00; C22C1/02; C22C19/03
Attorney, Agent or Firm:
Tan Ashida (2 outside)