Title:
【発明の名称】ボンデイング装置
Document Type and Number:
Japanese Patent JP2827060
Kind Code:
B2
Abstract:
A bonding apparatus for semiconductor devices, etc., including a bonding stage which places chips, etc. thereon, a bonding tool which press-bonds leads to the chips, etc., and a wire brush which is next to the bonding stage so as to clean the bonding tool. The wire brush is attached to the upper surface of a brush-rotating plate which is rotatable about its axis, and the brush-rotating plate is rotary-driven by a motor. A complete cleaning of all the side surfaces as well as the undersurface of the bonding tool is accomplished by bringing the bonding tool into contact with portions of the wire brush which are off the center of the rotating wire brush.
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Inventors:
SATO KIMIHARU
BANDO AKIO
BANDO AKIO
Application Number:
JP14392791A
Publication Date:
November 18, 1998
Filing Date:
May 20, 1991
Export Citation:
Assignee:
SHINKAWA KK
International Classes:
H01L21/603; B23K20/26; H01L21/00; H01L21/60; (IPC1-7): H01L21/603; H01L21/60
Domestic Patent References:
| JP344047A | ||||
| JP60246643A | ||||
| JP332041A | ||||
| JP3161272A |
Attorney, Agent or Firm:
Yoshinori Tanabe