Title:
【発明の名称】建物材料
Document Type and Number:
Japanese Patent JPH05507976
Kind Code:
A
Abstract:
A modular structural assembly (100) is disclosed for use in construction and for connection with other neighboring generally identical modular structural assemblies (100) to create a building structure. The modular strutural assembly (100) includes a structural subassembly having an inner volume and being mechanically connectable with the neighboring structural assemblies to define a building structure. The structural subassembly has a plurality of conduit connection apertures (110) distributed at least about the periphery thereof. The modular structural assembly also includes a utility subassembly (112) locatable within the inner volume. The utility subassembly (112) has a plurality of conduits extending from at least one junction in a plurality of directions, where the conduits are selectably connected together and locatable through the conduit connection apertures (110) for connection to corresponding utility subassemblies of the neighboring generally identical modular structural assemblies.
Inventors:
Zweibach Charles David
Application Number:
JP51176691A
Publication Date:
November 11, 1993
Filing Date:
June 18, 1991
Export Citation:
Assignee:
Zweibach Charles David
International Classes:
E03C1/00; E04B1/36; E04B1/58; E04B5/48; E04B1/34; E04C2/52; F24J2/04; F24J2/48; (IPC1-7): E04C2/52; E03C1/02; E04B1/34; E04B5/48
Attorney, Agent or Firm:
Minoru Nakamura (6 outside)