【発明の名称】半導体素子搭載用ケース

Title:

【発明の名称】半導体素子搭載用ケース

Document Type and Number:

Japanese Patent JP2926819

Kind Code:

B2

More Like This:

JP5318685	Electronic components and their manufacturing methods
WO/2000/078887	ADHESIVE, ADHESIVE MEMBER, CIRCUIT SUBSTRATE FOR SEMICONDUCTOR MOUNTING HAVING ADHESIVE MEMBER, AND SEMICONDUCTOR DEVICE CONTAINING THE SAME
JP2023114212	WIRING BOARD

Inventors:

YASUHARA MASAHARU
OOTSUKA AKIRA

Application Number:

JP34452389A

Publication Date:

July 28, 1999

Filing Date:

December 27, 1989

Export Citation:

Assignee:

SUMITOMO DENKI KOGYO KK

International Classes:

H01L23/14; H01L23/02; H01L23/06; (IPC1-7): H01L23/06; H01L23/02; H01L23/14

Domestic Patent References:

Attorney, Agent or Firm:

Tetsuji Ueshiro

Previous Patent: 光センサ

Next Patent: 飼いならした犬及び猫における食餌誘因カルニチン欠乏の防止法