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Patent Searching and Data


Title:
MANUFACTURE OF LAMINATED BOARD
Document Type and Number:
Japanese Patent JPS5812723
Kind Code:
A
Abstract:

PURPOSE: To obtain an inexpensive laminated board which is prevented from the production of burr, by a method wherein thermosetting resin is impregnated in a base material and dryed to obtain a prepreg, the prepreg is preliminarily cured by heating and pressurizing the periphery thereof, and a plural number of the prepregs is laminated and molded by heating and pressurizing.

CONSTITUTION: Thermosetting resin varnish, i.e., phenol resin, is impregnated and dried over a whole surface of a base material, i.e., paper, to obtain a prepreg, and the periphery of the obtained prepreg 1 is preliminarily cured by heating and pressurizing it preferably at 100W150°C, under 5W15kg/cm2 and for 2W5sec by means of upper and lower molds 2 and 3 in which a heater constituted in a squre is installed. A plural number of the prepregs, superposed with each other, is molded by heating and pressurizing to obtain a desired laminated board.


Inventors:
NAKAMURA TOSHIMITSU
Application Number:
JP11121681A
Publication Date:
January 24, 1983
Filing Date:
July 15, 1981
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B32B17/02; B29C43/02; B29C43/20; B29C43/34; B29C57/00; B29C67/00; B29C70/00; B32B17/06; (IPC1-7): B29D3/02; B32B17/02; B32B17/06
Attorney, Agent or Firm:
Ishida Choshichi