Title:
【発明の名称】洗浄装置及び洗浄方法
Document Type and Number:
Japanese Patent JP2696017
Kind Code:
B2
Abstract:
A cleaning apparatus and a cleaning method effectively clean the entire surface of a substrate to be cleaned by uniformly irradiating ultrasonic waves to the substrate. Ultrasonic waves generated by an ultrasonic oscillator provided on the side wall of an outer tank are transmitted through an ultrasonic wave transmission medium provided between the outer tank and an inner tank, for example, water, and are irradiated on a substrate to be cleaned, for example, a semiconductor wafer, in the inner tank through a cleaning chemical in the inner tank. By irradiating the ultrasonic waves from the side of the cleaning apparatus, a support base blocks the least amount of ultrasonic waves from reaching the substrate. This is effective to uniformly clean the substrate.
Inventors:
Masashi Omori
Satoru Koto
Shinji Nakajima
Satoru Koto
Shinji Nakajima
Application Number:
JP26228791A
Publication Date:
January 14, 1998
Filing Date:
October 09, 1991
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/304; H01L21/00; H01L21/027; (IPC1-7): H01L21/304; H01L21/027
Domestic Patent References:
| JP62281431A | ||||
| JP3222419A | ||||
| JP322547A |
Attorney, Agent or Firm:
Soga Doteru (6 people outside)