Title:
【発明の名称】半導体用導電性樹脂ペースト
Document Type and Number:
Japanese Patent JP2603375
Kind Code:
B2
Inventors:
Tsutomu Imai
Mizuno Masuo
Mizuno Masuo
Application Number:
JP13374391A
Publication Date:
April 23, 1997
Filing Date:
March 29, 1991
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08K9/06; C08G59/00; C08G59/18; C08G59/20; C08K3/08; C08L63/00; C09J9/02; C09J11/04; C09J163/00; H01B1/20; H01B1/22; H01L21/52; H05K1/09; (IPC1-7): H01L21/52; C08G59/20; C08K3/08; C08K9/06; C08L63/00
Domestic Patent References:
| JP63159422A |