Title:
【発明の名称】電気的抵抗構造体
Document Type and Number:
Japanese Patent JPH09503627
Kind Code:
A
Abstract:
An electrically resistive structure comprising a substrate (11) which is provided on at least one side with a first resistive film (13) and a second resistive film (17), the materials of these first and second films (13, 17) being mutually different, whereby an anti-diffusion film (15) is disposed between the first and second films (13, 17). The presence of such an anti-diffusion film (15) allows annealing of the resistive structure without significant degradation of its resistive properties. Suitable alloy materials for use in such an anti-diffusion film (15) include WTi, and particularly WTiN. Appropriate exemplary materials for the first resistive film (13) and second resistive film (17) include SiCr and CuNi alloys, respectively.
Inventors:
Hehel Anton
Young Edward Willem Albert
Young Edward Willem Albert
Application Number:
JP50635296A
Publication Date:
April 08, 1997
Filing Date:
July 17, 1995
Export Citation:
Assignee:
Philips Electronics Nemrose Fennaught Shap
International Classes:
H01C7/00; (IPC1-7): H01C7/00
Attorney, Agent or Firm:
Akihide Sugimura (1 outside)