Title:
METHOD AND DEVICE FOR CUTTING AND SEALING THERMOPLASTIC SYNTHETIC RESIN FILM OR SHEET
Document Type and Number:
Japanese Patent JPS604035
Kind Code:
A
Abstract:
A method for reducing wax build-up on sealing equipment where a heated element, such as a hot wire (20), cuts through and seals adjacent layers (14', 14") of a film orsheet of thermoplastic material containing thickened thermoplastic sections. The wax build-up is related to the contact between the wire and the thermoplastic material The improvement results from a proper shaping of the wire, by regulating the height of wire elevation with respect to the film and thickened sections, by using a wire having a genarally elongated cross-sectional shape, and by employing re'atively high wire travel speeds whereby it is possible to take advantage of the shrink back characteristics resulting from the orientation built into the thermoplastic material, so that minimum contact between the wire and the thermoplastic material is realized.
Inventors:
DENISU REI TAMINIA
Application Number:
JP10908983A
Publication Date:
January 10, 1985
Filing Date:
June 17, 1983
Export Citation:
Assignee:
DOW CHEMICAL CO
International Classes:
B29C65/02; B29C65/22; B29C65/74; B29K101/00; (IPC1-7): B29C65/74
Domestic Patent References:
| JPS4920781A | 1974-02-23 | |||
| JP52067563B | ||||
| JP41014129A |
Attorney, Agent or Firm:
Kyozo Yuasa
Next Patent: FORMATION OF DISPLAY BY LASER