Title:
【発明の名称】光半導体封止用エポキシ樹脂組成物
Document Type and Number:
Japanese Patent JP2807094
Kind Code:
B2
More Like This:
Inventors:
Tomohito Otsuki
Hiroshi Shimawaki
Hiroshi Shimawaki
Application Number:
JP41831490A
Publication Date:
September 30, 1998
Filing Date:
December 27, 1990
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/32; C08G59/20; H01L23/29; H01L23/31; (IPC1-7): H01L23/29; C08G59/32; H01L23/31
Domestic Patent References:
| JP62250659A | ||||
| JP62138521A |