Title:
【発明の名称】高耐圧半導体装置
Document Type and Number:
Japanese Patent JP2668713
Kind Code:
B2
Inventors:
Yoshikazu Kojima
Application Number:
JP24189588A
Publication Date:
October 27, 1997
Filing Date:
September 27, 1988
Export Citation:
Assignee:
Seiko Electronics Co., Ltd.
International Classes:
H01L29/78; (IPC1-7): H01L29/78
Domestic Patent References:
| JP58188164A | ||||
| JP60198780A |
Attorney, Agent or Firm:
Keinosuke Hayashi