PURPOSE: To enable works to be lessened in number of processes and fraction defective by a method wherein works are selectively transferred as required and loaded onto each processing section from a work sheet transfer mechanism or unloaded from each processing section and transferred to a work sheet transfer mechanism.

CONSTITUTION: Processing sections 101 wherein a lithography process is carried out are each equipped with a mechanism which loads wafers located at the prescribed positions in linear transfer paths 103 and 103b onto the processing sections 101 or unloads wafers from the processing sections 101. A ring-shaped transfer 102 is connected to various processing sections 104 to 107, 109 to 112, and 114 to 119. Each processing section is equipped with a mechanism which loads a wafer located at a position prescribed for each section in the ring-shaped transfer path 102 onto the processing section or unloads a wafer from the processing section. By this setup, a work can be lessened in number of processes and fraction defective.