Title:
WIRING STRUCTURE OF HIGH-DENSITY MOUNT MEMORY CARD AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JPH0699684
Kind Code:
A
Abstract:
PURPOSE: To make it possible to increase the number of chips mounted in a memory card of specified area.
CONSTITUTION: At least, one piece of semi-conductor chip 2 is provided on the front and/or the rear of a printed circuit board 1, and a conductor connected projecting almost vertically to the conductor part of a semi-conductor chip is connected to the wiring of pocket film in which a substrate containing a semi-conductor chip is stored.
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Inventors:
TSUNAKAWA TOYOHIRO
Application Number:
JP25300092A
Publication Date:
April 12, 1994
Filing Date:
September 22, 1992
Export Citation:
Assignee:
SONY CORP
International Classes:
B42D15/10; G06K19/077; G11C5/00; (IPC1-7): B42D15/10; G06K19/077; G11C5/00
Attorney, Agent or Firm:
Kunio Yamaguchi (1 person outside)
Next Patent: MAGNETIC CARD AND MAGNETIC CARD READER/WRITER