Title:
【発明の名称】半導体装置の製造装置
Document Type and Number:
Japanese Patent JP2569142
Kind Code:
B2
Inventors:
Toshihiko Sakai
Application Number:
JP22235388A
Publication Date:
January 08, 1997
Filing Date:
September 07, 1988
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01L21/603; H01L21/60; (IPC1-7): H01L21/603
Domestic Patent References:
| JPS5534429A | ||||
| JPS6231131A |
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)