Title:
【発明の名称】メモリモジュール
Document Type and Number:
Japanese Patent JP3082323
Kind Code:
B2
Abstract:
A memory module includes electrodes arranged on one side edge of a laminated substrate. A plurality of memory elements are mounted on the surface of the laminated substrate, wherein signal line electrodes for the memory elements are arranged on one side edge of the laminated substrate, and respective electrode terminals for a second power supply line and a second grounding line connected in parallel to a first power supply line and a first grounding line are provided on a surface of the laminated substrate. The electrodes are situated at a position at or near maximum amplitude of the potential distribution generated on the first power supply line and the first grounding line when the memory elements are driven.
Inventors:
Yuichi Takagi
Application Number:
JP19037491A
Publication Date:
August 28, 2000
Filing Date:
July 30, 1991
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L27/10; G11C5/14; G11C11/401; H05K1/02; H05K1/11; H05K3/42; (IPC1-7): H01L27/10; G11C11/401
Domestic Patent References:
| JP1258466A | ||||
| JP6415948A | ||||
| JP3283460A |